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1. product profile 1.1 general description general-purpose zener diodes in a sod 323f (sc-90) very small and flat lead surface-mounted device (smd) plastic package. 1.2 features and benefits 1.3 applications ? general regulation functions 1.4 quick reference data [1] pulse test: t p ? 300 ? s; ?? 0.02. [2] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for cathode 16 mm 2 . 2. pinning information [1] the marking bar indicates the cathode. tdzxj series single zener diodes rev. 2 ? 29 july 2011 product data sheet sod323f ? non-repetitive peak reverse power dissipation: ? 180 w ? low differential resistance ? total power dissipation: ? 500 mw ? aec-q101 qualified ? very small plastic package suitable for surface-mounted design table 1. quick reference data symbol parameter conditions min typ max unit v f forward voltage i f =100ma [1] --1.1v p tot total power dissipation t amb ? 25 ?c [2] --500mw table 2. pinning pin description simplified outline graphic symbol 1 cathode [1] 2 anode 2 1 006aaa152 2 1
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 2 of 12 nxp semiconductors tdzxj series single zener diodes 3. ordering information 4. marking table 3. ordering information type number package name description version tdzxj series sc-90 plastic surface-mounted package; 2 leads sod323f table 4. marking codes type number marking code type number marking code tdz2v4j 3a tdz9v1j 3q tdz2v7j 3b tdz10j 3r tdz3v0j 3c tdz11j 3s tdz3v3j 3d tdz12j 3t tdz3v6j 3e tdz13j 3u tdz3v9j 3f tdz15j 3v tdz4v3j 3g tdz16j 3w TDZ4V7J 3h tdz18j 3y tdz5v1j 3j tdz20j 3z tdz5v6j jq tdz22j 4a tdz6v2j 3k tdz24j 4b tdz6v8j 3l tdz27j 4c tdz7v5j 3n tdz30j 4d tdz8v2j 3p - -
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 3 of 12 nxp semiconductors tdzxj series single zener diodes 5. limiting values [1] t p =100 ? s; square wave; t j =25 ? c before surge. [2] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 16 mm 2 . 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 16 mm 2 . [2] soldering point of cathode tab. 7. characteristics [1] pulse test: t p ? 300 ? s; ?? 0.02. table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit i f forward current - 250 ma i zsm non-repetitive peak reverse current [1] -see ta b l e 8 and 10 p zsm non-repetitive peak reverse power dissipation [1] tdz2v4j to tdz5v6j - 180 w tdz6v2j to tdz6v8j - 100 w tdz7v5j to tdz30j - 40 w p tot total power dissipation t amb ? 25 ?c [2] -500mw t j junction temperature - 150 ?c t amb ambient temperature ? 55 +150 ?c t stg storage temperature ? 65 +150 ?c table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] --250k/w r th(j-sp) thermal resistance from junction to solder point [2] --25k/w table 7. characteristics t j =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage [1] i f =10ma - - 0.9 v i f =100ma - - 1.1 v
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 4 of 12 nxp semiconductors tdzxj series single zener diodes [1] f = 1 mhz; v r =0v [2] t p = 100 ? s; square wave; t j =25 ? c before surge. table 8. characteristics per type; zener tdz2v4j to zener tdz24j t j =25 ? c unless otherwise specified. tdzxxxj working voltage v z (v) differential resistance r dif (? ) reverse current i r (? a) temperature coefficient s z (mv/k) diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] i z =5ma i z =1ma i z =5ma i z =5ma min max max max max v r (v) min max max max 2v4 2.35 2.45 400 100 50 1.0 ? 3.5 0 450 15 2v7 2.65 2.75 450 100 20 1.0 ? 3.5 0 440 15 3v0 2.94 3.06 500 95 10 1.0 ? 3.5 0 425 15 3v3 3.23 3.37 500 95 5 1.0 ? 3.5 0 410 15 3v6 3.53 3.67 500 90 5 1.0 ? 3.5 0 390 15 3v9 3.82 3.98 500 90 3 1.0 ? 3.5 0 370 15 4v3 4.21 4.39 600 90 3 1.0 ? 3.5 0 350 15 4v7 4.61 4.79 500 80 3 2.0 ? 3.5 0.2 325 15 5v1 5.00 5.20 480 60 2 2.0 ? 2.7 1.2 300 15 5v6 5.49 5.71 400 40 10 2.5 ? 22.5275 15 6v2 6.08 6.32 150 10 3 4.0 0.4 3.7 250 12 6v8 6.66 6.94 80 15 2 4.0 1.2 4.5 215 12 7v5 7.5 7.65 80 10 1 5.0 2.5 5.3 170 4.0 8v2 8.04 8.36 80 10 0.70 5.0 3.2 6.2 150 4.0 9v1 8.92 9.28 100 10 0.50 6.0 3.8 7.0 120 3.0 10 9.80 10.20 150 10 0.20 7.0 4.5 8.0 110 3.0 11 10.80 11.20 150 10 0.10 8.0 5.4 9.0 108 2.5 12 11.80 12.20 150 10 0.10 8.0 6.0 10 105 2.5 13 12.70 13.30 170 10 0.10 8.0 7.0 11 103 2.5 15 14.70 15.30 200 15 0.05 10.5 9.2 13 99 2.0 16 15.70 16.30 200 20 0.05 11.2 10.4 14 97 1.5 18 17.6 18.4 225 20 0.05 12.6 12.4 16 93 1.5 20 19.6 20.4 225 20 0.05 14.0 14.4 18 88 1.5 22 21.6 22.4 250 25 0.05 15.4 16.4 20 84 1.25 24 23.5 24.5 250 30 0.05 16.8 18.4 22 80 1.25 table 9. characteristics per type; zener tdz5v6j t j =25 ? c unless otherwise specified. tdzxxxj working voltage v z (v) differential resistance r dif (? ) temperature coefficient s z (mv/k) i z =10ma i z =0.5ma i z =10ma i z =5ma min max max max min max 5v6 5.20 6.00 500 7 ? 1.7 2.8
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 5 of 12 nxp semiconductors tdzxj series single zener diodes [1] f = 1 mhz; v r =0v [2] t p = 100 ? s; square wave; t j =25 ? c before surge. table 10. characteristics per type; zener tdz27j to zener tdz30j t j =25 ? c unless otherwise specified. tdzxxxj working voltage v z (v) differential resistance r dif (? ) reverse current i r (? a) temperature coefficient s z (mv/k) diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] i z =2ma i z =0.5ma i z =2ma i z =2ma min max max max max v r (v) min max max max 27 26.5 27.5 250 40 0.05 18.9 21.4 25.3 73 1 30 29.4 30.6 250 40 0.05 21 24.4 29.4 66 1 (1) tdz2v4j to tdz5v6j (2) tdz6v2j to tdz6v8j (3) tdz7v5j to tdz30j; t j =25 ? c before surge (4) tdz7v5j to tdz30j; t j = 150 ? c before surge t j =25 ? c fig 1. non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values fig 2. forward current as a function of forward voltage; typical values 006aac671 10 2 10 10 3 p zsm (w) 1 t p (s) 10 ?4 10 ?2 10 ?3 (1) (2) (4) (3) v f (v) 0.6 1 0.8 mbg781 100 200 300 i f (ma) 0
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 6 of 12 nxp semiconductors tdzxj series single zener diodes 8. test information 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. tdz2v4j to TDZ4V7J t j =25 ? c to 150 ? c tdz5v1j to tdz15j t j =25 ? c to 150 ? c fig 3. temperature coefficient as a function of working current; typical values fig 4. temperature coefficient as a function of working current; typical values tdz2v7j to tdz6v6j t j =25 ? c tdz10j to tdz27j t j =25 ? c fig 5. working current as a function of working voltage; typical values fig 6. working current as a function of working voltage; typical values i z (ma) 10 ?1 10 2 10 1 mld444 ?1 ?0.5 ?1.5 0 0.5 s z (mv/k) ?2 2v4 4v7 4v3 3v9 3v6 3v3 3v0 2v7 mld445 4 0 8 12 s z (mv/k) ?4 i z (ma) 10 ?1 10 2 10 1 15 13 12 11 10 9v1 5v6 5v1 8v2 7v5 6v8 6v2 v z (v) 010 8 46 2 006aaa996 20 30 10 40 50 i z (ma) 0 v z(nom) (v) = 2.7 3.3 3.9 4.7 5.6 6.8 8.2 006aac672 v z (v) 030 20 10 10 20 30 i z (ma) 0 27 22 18 12 15 v z(nom) (v) = 10
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 7 of 12 nxp semiconductors tdzxj series single zener diodes 9. package outline 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . fig 7. package outline sod323f (sc-90) 04-09-13 dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 table 11. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 tdzxj series sod323f 4 mm pitch, 8 mm tape and reel -115 -135
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 8 of 12 nxp semiconductors tdzxj series single zener diodes 11. soldering reflow soldering is the only recommended soldering method. fig 8. reflow soldering footprint sod323f (sc-90) 0.95 1.65 2.2 2.1 3.05 solder lands solder resist occupied area solder paste dimensions in mm 0.5 (2) 0.6 (2) 0.6 (2) 0.5 (2) sod323f_fr
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 9 of 12 nxp semiconductors tdzxj series single zener diodes 12. revision history table 12. revision history document id release date data sheet status change notice supersedes tdzxj_ser v.2 20110729 product data sheet - tdz5v6j v.1 modifications: ? added type numbers tdz2v4j, tdz2v7j, tdz3v0j, tdz3v3j, tdz3v6j, tdz3v9j, tdz4v3j, TDZ4V7J, tdz5v1j, tdz6v2j, tdz6v8j, tdz7v5j, tdz8v2j, tdz9v1j, tdz10j, tdz11j, tdz12j, tdz13j, tdz15j, tdz16j, tdz18j, tdz20j, tdz22j, tdz24j, tdz27j and tdz30j. ? added ta b l e 8 to 10 . ? updated figure 1 to 4 and added figure 5 and 6 . tdz5v6j v.1 20100823 product data sheet - -
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 10 of 12 nxp semiconductors tdzxj series single zener diodes 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
tdzxj_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 29 july 2011 11 of 12 nxp semiconductors tdzxj series single zener diodes quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors tdzxj series single zener diodes ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 29 july 2011 document identifier: tdzxj_ser please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 packing information . . . . . . . . . . . . . . . . . . . . . 7 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 contact information. . . . . . . . . . . . . . . . . . . . . 11 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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